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INTEGRATED CIRCUITS
DATA SHEET
TDA8771A Triple 8-bit video Digital-to-Analog Converter (DAC)
Product specification File under Integrated Circuits, IC02 1996 Jan 25
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
FEATURES * 8-bit resolution * Sampling rate up to 35 MHz * Internal reference voltage regulator * No deglitching circuit required * Large output voltage range * 1 k output load * Power dissipation only 200 mW * Single 5 V power supply * 44-pin QFP package. APPLICATIONS * General purpose high-speed digital-to-analog conversion * Digital TV * Graphic display * Desktop video processing. QUICK REFERENCE DATA SYMBOL VDDA VDDD IDDA IDDD INL DNL fclk(max) Ptot Note PARAMETER analog supply voltage digital supply voltage analog supply current digital supply current integral non-linearity differential non-linearity maximum clock frequency total power dissipation RL = 1 k; note 1 fclk = 35 MHz fclk = 35 MHz; ramp input fclk = 35 MHz; ramp input CONDITIONS MIN. 4.5 4.5 10 - - - 35 RL = 1 k; fclk = 35 MHz; note 1 45 TYP. 5.0 5.0 33 7 0.5 0.25 - 200 GENERAL DESCRIPTION
TDA8771A
The TDA8771A is a triple 8-bit video Digital-to-Analog Converter (DAC). It converts the digital input signals into analog voltage outputs at a maximum conversion rate of 35 MHz. The DACs are based on resistor-string architecture with integrated output buffers. The output voltage range is determined by a built-in reference source. The device is fabricated in a 5 V, CMOS process that ensures high functionality with low power dissipation.
MAX. 5.5 5.5 45 20 1 0.5 - 360
UNIT V V mA mA LSB LSB MHz mW
1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1. ORDERING INFORMATION TYPE NUMBER TDA8771AH PACKAGE NAME DESCRIPTION VERSION SOT307-2
QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
1996 Jan 25
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
BLOCK DIAGRAM
handbook, full pagewidth
TDA8771A
V DDA 32,35,39,43 4 12 to 9
V DDD 7,27 4
clock input 31 1 reference current input (I REF )
RED digital inputs (bits R0 to R3)
TDA8771A
LSB DECODER
RED digital inputs (bits R4 to R7)
4
8 5 to 3
4
MSB DECODER
RESISTOR STRING
44
RED analog output
GREEN digital inputs (bits G0 to G3)
4
20 to 17 4
LSB DECODER
GREEN digital inputs (bits G4 to G7)
4
16 to 13
4
MSB DECODER
RESISTOR STRING
40
GREEN analog output
BLUE digital inputs (bits B0 to B3)
4
30,29 26,25 4
LSB DECODER
BLUE digital inputs (bits B4 to B7)
4
24 to 21
4
MSB DECODER
RESISTOR STRING
36
BLUE analog output
BANDGAP REFERENCE 34, 37, 38,41 not connected 33 reference voltage decoupling input (VREF ) 2,42 6,28
MBH039
V SSA
V SSD
Fig.1 Block diagram.
1996 Jan 25
3
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
PINNING SYMBOL IREF VSSA1 R7 R6 R5 VSSD1 VDDD1 R4 R3 R2 R1 R0 G7 G6 G5 G4 G3 G2 G1 G0 B7 B6 B5 B4 B3 B2 VDDD2 VSSD2 B1 B0 CLK VDDA1 VREF n.c. VDDA2 OUTB n.c. n.c. VDDA3 OUTG 1996 Jan 25 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 analog supply ground 1 RED digital input data; bit 7 (MSB) RED digital input data; bit 6 RED digital input data; bit 5 digital supply ground 1 digital supply voltage 1 RED digital input data; bit 4 RED digital input data; bit 3 RED digital input data; bit 2 RED digital input data; bit 1 RED digital input data; bit 0 (LSB) GREEN digital input data; bit 7 (MSB) GREEN digital input data; bit 6 GREEN digital input data; bit 5 GREEN digital input data; bit 4 GREEN digital input data; bit 3 GREEN digital input data; bit 2 GREEN digital input data; bit 1 GREEN digital input data; bit 0 (LSB) BLUE digital input data; bit 7 (MSB) BLUE digital input data; bit 6 BLUE digital input data; bit 5 BLUE digital input data; bit 4 BLUE digital input data; bit 3 BLUE digital input data; bit 2 digital supply voltage 2 digital supply ground 2 BLUE digital input data; bit 1 BLUE digital input data; bit 0 (LSB) clock input analog supply voltage 1 decoupling input for reference voltage not connected analog supply voltage 2 BLUE analog output not connected not connected analog supply voltage 3 GREEN analog output 4 DESCRIPTION reference current input for output buffers
TDA8771A
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
SYMBOL n.c. VSSA2 VDDA4 OUTR PIN 41 42 43 44 not connected analog supply ground 2 analog supply voltage 4 RED analog output DESCRIPTION
TDA8771A
43 V DDA4
35 V DDA2
42 VSSA2
OUTR
OUTG
37 n.c.
41 n.c.
38 n.c.
OUTB
handbook, full pagewidth
V DDA3
index corner I REF V SSA1 R7 R6 R5 V SSD1 VDDD1 R4 R3 1 2 3 4 5 6 7 8 9
34 n.c.
44
40
39
36
33 V REF 32 V DDA1 31 CLK
30 B0 29 B1
TDA8771A
28 VSSD2 27 V DDD2 26 B2 25 B3 24 B4 23 B5
R2 10 R1 11
G0 20
B7 21
R0 12
G7 13
G6 14
G5 15
B6 22
G4 16
G3 17
G2 18
G1 19
MBH040
Fig.2 Pin configuration.
1996 Jan 25
5
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134). SYMBOL VDDA VDDD VDD Tstg Tamb Tj analog supply voltage digital supply voltage supply voltage difference between VDDA and VDDD storage temperature operating ambient temperature junction temperature PARAMETER MIN. -0.5 -0.5 -1.0 -55 0 -
TDA8771A
MAX. +6.5 +6.5 +1.0 +150 +70 +125 V V V C C C
UNIT
THERMAL CHARACTERISTICS SYMBOL Rth j-a HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. PARAMETER thermal resistance from junction to ambient in free air VALUE 75 UNIT K/W
1996 Jan 25
6
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
CHARACTERISTICS VDDA = VDDD = 4.5 to 5.5 V; VSSA and VSSD shorted together; VDDA - VDDD = -0.5 to +0.5 V; Tamb = 0 to 70 C; typical values measured at VDDA = VDDD = 5 V and Tamb = 25 C; unless otherwise specified. SYMBOL Supply VDDA VDDD IDDA IDDD Inputs CLOCK INPUT (PIN 31) VIL VIH VIL VIH II fclk(max) tCPH tCPL tr tf tSU;DAT tHD;DAT LOW level input voltage HIGH level input voltage 0 2.0 - - - - 0.6 - - - - - - - 1.2 VDDD 1.2 VDDD 0.7 - - - 5 6 - - V V analog supply voltage digital supply voltage analog supply current digital supply current RL = 1 k; note 1 fclk = 35 MHz 4.5 4.5 10 - 5.0 5.0 33 7 5.5 5.5 45 20 V V mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R, G, B DIGITAL INPUTS (PINS 12 TO 8, 5 TO 3, 20 TO 13, 30, 29 AND 26 TO 21) LOW level input voltage HIGH level input voltage (PIN 1) - mA 0 2.0 V V
IREF REFERENCE CURRENT INPUT FOR OUTPUT BUFFERS
input current
Timing; see Fig.3 maximum clock frequency clock pulse width HIGH clock pulse width LOW clock rise time clock fall time input data set-up time input data hold time 35 8 8 - - 4 4 MHz ns ns ns ns ns ns
Voltage reference (pin 33, referenced to VSSA) VREF Outputs OUTB, OUTR, OUTG ANALOG OUTPUTS (PINS 36, 44 AND 40, REFERENCED TO VSSA) FOR 1 k LOAD; see Table 1 FSR Vos VOmax VOmin THD ZL full-scale output voltage range offset of analog voltage output maximum output voltage minimum output voltage total harmonic distortion output load impedance data inputs = logic 1; note 2 data inputs = logic 0; note 2 fi = 4.43 MHz; fclk = 35 MHz 2.80 - 2.95 0.05 - 0.9 2.95 0.25 3.20 0.25 -44 1.0 3.10 - 3.45 0.45 - 1.1 V V V V dB k output reference voltage 1.180 1.242 1.305 V
1996 Jan 25
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TDA8771A
MAX.
UNIT
Transfer function (fclk = 35 MHz) INL DNL ct integral non-linearity differential non-linearity crosstalk DAC to DAC DAC to DAC matching Switching characteristics (for 1 k output load); see Fig.4 td ts1 ts2 Vg Notes 1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1. 2. VO is directly proportional to VREF. Table 1 Input coding and DAC output voltages (typical values) BINARY INPUT DATA (SYNC = BLANK = 0) 0000 0000 0000 0001 .... .... 1000 0000 .... .... 1111 1110 1111 1111 CODE 0 1 . 128 . 254 255 DAC OUTPUT VOLTAGES (V) OUTB, OUTR, OUTG RL = 1 k 0.262 0.273 . 1.731 . 3.188 3.200 input to 50% output delay time settling time settling time full-scale change 10% to 90% of full-scale change to 1 LSB - - - - 12 15 50 - - - - ns ns ns ramp input ramp input - - -50 - 0.5 0.25 - 1.0 1 0.5 - 2.0 LSB LSB dB %
Output transients (glitches) area for 1 LSB change 1 LSBns
1996 Jan 25
8
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TIMING
TDA8771A
handbook, full pagewidth
data input
,,,,, ,,,,,
t CPL
t SU; DAT
t HD; DAT
stable
,,,,, ,,,,,
MBB656 - 1
V IH 50 % V IL
clock input
50 % V IL t CPH
Fig.3 Input timing.
handbook, full pagewidth
clock input
50 % code 1023 code 0
input code (example of a full-scale input data transition)
714 mV (code 1023)
1 LSB 10 %
td
50 %
Vo(1)
90 % 54 mV (code 0) t s1 t s2 1 LSB
MBB662 - 3
Fig.4 Switching timing.
1996 Jan 25
9
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
INTERNAL CIRCUITRY
TDA8771A
1/1 page = 296 mm (Datasheet)
V DDD V DDA
27 mm
GND
DACs resistor string V SSA
V SSD
(a)
(b)
V DDA
V DDA
V DDA V DD
V DD
V DD
V DD
125 (typ.) GND
V SSA
MBB658 - 1
(c)
(d)
(a) Digital inputs; pins 3 to 5, 8 to 26 and 29 to 31. (b) VREF; pin 33. (c) IREF; pin 1. (d) OUTR, G, B; pins 44, 40 and 36.
Fig.5 Internal circuitry.
1996 Jan 25
10
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
APPLICATION INFORMATION
TDA8771A
handbook, full pagewidth
V SSA 5 V OUTR 1 k 10 nF V SSA V DDA4 V SSA2 n.c.
V SSA 5 V OUTG 1 k 10 nF V SSA VDDA3 n.c. 40 39 38 37
V SSA 5 V OUTB 1 k 10 nF VSSA V DDA2 n.c. 36 35 34 33 V REF 100 nF V DDA1
n.c.
V SSA 6.8 k
44 I REF 1
43
42
41
V SSA
V SSA1
2
32
5V 10 nF CLK V SSA
R7
3
31
R6
4
30
B0
R5
5
29
B1
V SSD1 V DDD1 10 nF V SSD R4
6
TDA8771A
28
VSSD2 V DDD2
5V
7
27
5V 10 nF B2 V SSD
8
26
R3
9
25
B3
R2
10
24
B4
R1
11 12 13 14 15 16 17 18 19 20 21 22
23
B5
MBH041
R0
G7
G6
G5
G4
G3
G2
G1
G0
B7
B6
Analog and digital supplies should be separated and decoupled. Supplies are not connected internally. All ground pins must be connected. One ground plane is preferred although it depends on application. See Figs 7 and 9 for example of anti-aliasing filter.
Fig.6 Application diagram.
1996 Jan 25
11
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
handbook, full pagewidth
TDA8771A
125 OUTR (pin 44) and OUTG (pin 40) and OUTB (pin 36) 180
12 H
12 H
18 pF
18 pF 820
analog video output (R,G or B) 2.4 V (p-p)
56 pF
150 pF
56 pF
MBH042
analog ground
Fig.7 Example of anti-aliasing filter for 2.4 V output swing.
Characteristics of Fig.8 * Order 5; adapted CHEBYSHEV
0 1/2 page (Datasheet) (dB) 40
MSA693
* Ripple 0.7 dB * f at -3 dB = 6.2 MHz
22 mm
* fNOTCH = 10.8 MHz.
80
120
160
0
10
20
30
f (MHz)
40
Fig.8 Frequency response for filter shown in Fig.7.
1996 Jan 25
12
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
handbook, full pagewidth
TDA8771A
125 OUTR (pin 44) and OUTG (pin 40) and OUTB (pin 36) 500
27 H
27 H
6.8 pF
6.8 pF 500
analog video output (R,G or B) 1.5 V (p-p)
27 pF
68 pF
27 pF
MBH043
analog ground
Fig.9 Example of anti-aliasing filter for 1.5 V output swing.
Characteristics of Fig.10 * Order 5; adapted CHEBYSHEV
0 1/2 page (Datasheet) (dB) 40
MSA694
* Ripple 0.25 dB * f at -3 dB = 5.6 MHz
22 mm
* fNOTCH = 11.7 MHz.
80
120
160
0
10
20
30 f i (MHz)
40
Fig.10 Frequency response for filter shown in Fig.9.
1996 Jan 25
13
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
PACKAGE OUTLINE QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
TDA8771A
SOT307-2
c
y X
A 33 34 23 22 ZE
e E HE wM bp pin 1 index 44 1 bp D HD wM 11 ZD B vM B vMA 12 detail X A A2 (A 3) Lp L
A1
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.10 A1 0.25 0.05 A2 1.85 1.65 A3 0.25 bp 0.40 0.20 c 0.25 0.14 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.8 HD 12.9 12.3 HE 12.9 12.3 L 1.3 Lp 0.95 0.55 v 0.15 w 0.15 y 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 10 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT307-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 97-08-01
1996 Jan 25
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all QFP packages. The choice of heating method may be influenced by larger plastic QFP packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our "Quality Reference Handbook" (order code 9397 750 00192). Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
TDA8771A
Wave soldering is not recommended for QFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. Even with these conditions, do not consider wave soldering the following packages: QFP52 (SOT379-1), QFP100 (SOT317-1), QFP100 (SOT317-2), QFP100 (SOT382-1) or QFP160 (SOT322-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Jan 25
15
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8771A
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Jan 25
16
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
NOTES
TDA8771A
1996 Jan 25
17
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
NOTES
TDA8771A
1996 Jan 25
18
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
NOTES
TDA8771A
1996 Jan 25
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Printed in The Netherlands
537021/1100/01/pp20 Document order number: Date of release: 1996 Jan 25 9397 750 00591

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